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| NTUD3170NZ Small Signal MOSFET 20 V, 220 mA, Dual N-Channel, 1.0 mm x 1.0 mm SOT-963 Package Features * Dual N-Channel MOSFET * Offers a Low RDS(ON) Solution in the Ultra Small 1.0 x 1.0 mm * * * http://onsemi.com V(BR)DSS 20 V RDS(ON) MAX 1.5 W @ 4.5 V 2.0 W @ 2.5 V 3.0 W @ 1.8 V 4.5 W @ 1.5 V D1 D2 0.22 A ID Max Package 1.5 V Gate Voltage Rating Ultra Thin Profile (< 0.5 mm) Allows It to Fit Easily into Extremely Thin Environments such as Portable Electronics This is a Pb-Free Device Applications * General Purpose Interfacing Switch * Optimized for Power Management in Ultra Portable Equipment * Analog Switch MAXIMUM RATINGS (TJ = 25C unless otherwise specified) Parameter Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current (Note 1) Steady State tv5s Power Dissipation (Note 1) Pulsed Drain Current Steady State tv5s tp = 10 ms IDM TJ, TSTG IS TL Operating Junction and Storage Temperature Source Current (Body Diode) (Note 2) Lead Temperature for Soldering Purposes (1/8" from case for 10 s) TA = 25C TA = 85C TA = 25C TA = 25C PD 200 800 -55 to 150 200 260 mA C mA C ID Symbol VDSS VGS Value 20 8 220 160 280 125 mW mA Unit V V G1 G2 S1 N-Channel MOSFET S2 PINOUT: SOT-963 S1 1 6 D1 G1 2 5 G2 D2 3 Top View 4 S2 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface-mounted on FR4 board using the minimum recommended pad size, 1 oz Cu. 2. Pulse Test: pulse width v300 ms, duty cycle v2% MARKING DIAGRAM SOT-963 CASE 527AD 3 M G 3MG 1 = Specific Device Code = Date Code = Pb-Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. (c) Semiconductor Components Industries, LLC, 2008 August, 2008 - Rev. 0 1 Publication Order Number: NTUD3170NZ/D NTUD3170NZ THERMAL RESISTANCE RATINGS Parameter Junction-to-Ambient - Steady State (Note 3) Junction-to-Ambient - t = 5 s (Note 3) Symbol RqJA Max 1000 600 Unit C/W 3. Surface-mounted on FR4 board using the minimum recommended pad size, 1 oz Cu. ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified) Parameter OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage Zero Gate Voltage Drain Current IDSS Gate-to-Source Leakage Current ON CHARACTERISTICS (Note 4) Gate Threshold Voltage Drain-to-Source On Resistance VGS(TH) VGS = VDS, ID = 250 mA VGS = 4.5 V, ID = 100 mA VGS = 2.5 V, ID = 50 mA RDS(ON) VGS = 1.8 V, ID = 20 mA VGS = 1.5 V, ID = 10 mA VGS = 1.2 V, ID = 1.0 mA Forward Transconductance Source-Drain Diode Voltage CAPACITANCES Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS td(ON) tr td(OFF) tf VGS = 4.5 V, VDD = 10 V, ID = 200 mA, RG = 2.0 W f = 1.0 MHz, VGS = 0 V VDS = 15 V 12.5 3.6 2.6 pF gFS VSD VDS = 5.0 V, ID = 125 mA VGS = 0 V, IS = 10 mA 0.4 0.75 1.0 1.4 1.8 2.8 0.48 0.6 1.0 S V 1.0 1.5 2.0 3.0 4.5 W V IGSS V(BR)DSS VGS = 0 V, ID = 250 mA VGS = 0 V, VDS = 5 V VGS = 0 V, VDS = 16 V TJ = 25C TJ = 85C TJ = 25C 20 50 200 100 100 V nA nA nA Symbol Test Condition Min Typ Max Unit VDS = 0 V, VGS = 5.0 V SWITCHING CHARACTERISTICS, VGS = 4.5 V (Note 4) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 16.5 25.5 142 80 ns 4. Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Device NTUD3170NZT5G Package SOT-963 (Pb-Free) Shipping 8000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 NTUD3170NZ TYPICAL CHARACTERISTICS 0.4 1.8 V 0.3 VGS = 2 thru 5 V TJ = 25C 1.6 V 1.4 V ID, DRAIN CURRENT (A) 0.4 VDS 5 V 0.3 TJ = -55C TJ = 25C TJ = 125C ID, DRAIN CURRENT (A) 0.2 0.2 0.1 1.2 V 0.1 0 0 1 2 3 4 5 0 0 1 2 3 VDS, DRAIN-TO-SOURCE VOLTAGE (V) VGS, GATE-TO-SOURCE VOLTAGE (V) Figure 1. On-Region Characteristics 4 RDS(on), DRAIN-TO-SOURCE RESISTANCE (W) RDS(on), DRAIN-TO-SOURCE RESISTANCE (W) ID = 220 mA TJ = 25C 3 1.50 Figure 2. Transfer Characteristics TJ = 25C 1.25 1.00 0.75 0.50 0.25 0 VGS = 2.5 V VGS = 4.5 V 2 1 0 0 1 2 3 4 5 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 VGS, GATE-TO-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A) Figure 3. On-Resistance vs. Gate Voltage 1.75 RDS(on), DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) ID = 100 mA 1.50 1.25 1.00 0.75 0.50 -50 10 IDSS, LEAKAGE (nA) VGS = 4.5 V 10,000 Figure 4. On-Resistance vs. Drain Current and Gate Voltage VGS = 0 V 1000 TJ = 150C TJ = 125C 100 -25 0 25 50 75 100 125 150 0 4 8 12 16 20 TJ, JUNCTION TEMPERATURE (C) VDS, DRAIN-TO-SOURCE VOLTAGE (V) Figure 5. On-Resistance Variation with Temperature Figure 6. Drain-to-Source Leakage Current vs. Voltage http://onsemi.com 3 NTUD3170NZ TYPICAL CHARACTERISTICS 20.0 17.5 C, CAPACITANCE (pF) 15.0 12.5 10.0 7.50 5.00 2.50 0 0 Crss 1 Coss Ciss VGS = 0 V TJ = 25C t, TIME (ns) 100 1000 VDD = 10 V ID = 200 mA VGS = 4.5 V td(off) tf tr td(on) 10 5 10 15 20 1 10 RG, GATE RESISTANCE (W) 100 GATE-TO-SOURCE AND DRAIN-TO-SOURCE VOLTAGE (V) Figure 7. Capacitance Variation 0.200 IS, SOURCE CURRENT (A) 0.175 0.150 0.125 0.100 0.075 0.050 0.025 0 0 0.2 0.4 0.6 Figure 8. Resistive Switching Time Variation vs. Gate Resistance VGS = 0 V TJ = 25C 0.8 1 VSD, SOURCE-TO-DRAIN VOLTAGE (V) Figure 9. Diode Forward Voltage vs. Current http://onsemi.com 4 NTUD3170NZ PACKAGE DIMENSIONS SOT-963 CASE 527AD-01 ISSUE D C L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b C D E e L HE MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.05 0.10 0.15 0.95 1.00 1.05 MIN 0.004 0.003 0.037 0.03 INCHES NOM MAX D A B 4 E 3 C 0.08 C A B A 6 5 12 e HE 6X b 0.006 0.008 0.005 0.007 0.039 0.041 0.032 0.034 0.014 BSC 0.002 0.004 0.006 0.037 0.039 0.041 SOLDERING FOOTPRINT* 0.35 0.014 0.35 0.014 0.90 0.0354 0.20 0.008 0.20 0.008 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 NTUD3170NZ/D |
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